Electron device having metallic connecting structure and method for making the same

ABSTRACT

An exemplary electronic device having a metallic connecting structure includes a metallic housing, at least one bonding film and at least one metallic clip. The at least one metallic clip includes a base and a U-shaped elastic portion, the U-shaped elastic portion having a pair of feet portions extending from the base and bending up and outwards. The metallic clip is fixed to an inner surface of the metallic housing via the bonding film.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates, generally, to electronic devices havingmetallic connecting structure, and a method for making the electronicdevices having metallic connecting structure.

2. Discussion of the Related Art

With the development of wireless communication and informationprocessing technologies, portable electronic devices such as notebookcomputers, mobile phones, and personal digital assistants (PDAs) are nowin widespread use. In order to obtain the electronic devices with a highmechanical strength and an attractive appearance, the electronic devicesusually employ a housing made with metal materials, such as stainlesssteel, magnesium-aluminum alloy, and so on.

Typically, the metallic housing of the electronic device is manufacturedby punching a raw metal sheet. A number of clasping or latchingstructures are usually defined at an inner surface of the metallichousing. The clasping or latching structures are configured forattaching or holding inner electronic components in the electronicdevice or for connecting to other parts of the metallic housing. Forexample, a metallic clip fixed to the inner surface of the metallichousing such that the metallic clip can be assembled to act as arestraint that presses down on some of the electronic components in theelectronic device to keep them in place. A number of studs formed on theinner surface of the metallic housing such that some of the electroniccomponents can be fixed onto the metallic housing via screws engagedwith the studs.

Generally, because the clasping or latching structures of the metallichousing are complicated, the metallic housing with the clasping orlatching structures is difficult to be manufactured by punching.Nowadays, the metallic clips and metallic studs are welded onto theinner surface of the metallic housing by laser. However, an outersurface of the metallic housing may deform or change color due to thehigh temperature of the laser welding. Accordingly, the electronicdevice having the metallic housing cannot have an attractive appearance.

What is needed, therefore, is an electron device having metallicconnecting structures that overcomes the above mentioned disadvantages.Methods for making the electron device are also desired.

SUMMARY

In one aspect, an electronic device having metallic connecting structureaccording to a preferred embodiment includes a metallic housing, atleast one bonding film and at least one metallic element. The metallicelement is fixed to an inner surface of the metallic housing via thebonding film.

In another aspect, a method for making the electronic device describedin a previous paragraph includes: providing a hot press machine having apress head; placing the one bonding film on the inner surface of themetallic housing; turning on the hot press machine and heating the presshead to a first predetermined temperature of about 40° C. to about 50°C.; after heated to the first predetermined temperature, driving thepress head to press the bonding film to the metallic housing for abouttwo minutes, thereby attaching the bonding film on the metallic housing;placing the metallic element according to the corresponding bonding filmof the metallic housing; heating the press head to a secondpredetermined temperature of about 160° C. to about 170° C.; afterheated to the second predetermined temperature, driving the press headto press the metallic housing to the at least one metallic element forat least two minutes, thereby attaching the at least one metallicelement on the corresponding bonding film.

Other advantages and novel features will become more apparent from thefollowing detailed description of the preferred embodiments, when takenin conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The components in the drawings are not necessarily drawn to scale, theemphasis instead being placed upon clearly illustrating the principlesof the present electronic device having metallic connecting structuresand method for making the electronic device. Moreover, in the drawings,like reference numerals designate corresponding parts throughout theseveral views, and all the views are schematic.

FIG. 1 is an exploded, isometric view of an electronic device havingmetallic connecting structure according to a first preferred embodimentof the present invention.

FIG. 2 is a side view of the electronic device having metallicconnecting structure of FIG. 1.

FIG. 3 is a partial, cross-sectional view of an electronic device havingmetallic connecting structure according to a second preferred embodimentof the present invention.

FIG. 4 is an enlarged view of a circle portion IV of FIG. 3.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Reference will now be made to the drawings to describe preferredembodiments of the present electronic device having metallic connectingstructure and methods for making the electronic device, in detail.

Referring to FIGS. 1 and 2, a metallic connecting structure 20 of anelectronic device (for example, a MP3) in accordance with a firstpreferred embodiment of the present invention is shown. The metallicconnecting structure 20 includes a metallic housing 21, a bonding film23, and a metallic clip 25. The metallic clip 25 is fixed to an innersurface of the metallic housing 21 via the bonding film 23. The metallicconnecting structure 20 may be part of a housing of the electronicdevice. In this embodiment, the metallic housing 21 is a curved sheet.The bonding film 23 is a thermoplastic adhesive bonding film. Themetallic clip 25 includes a base 251 and a U-shaped elastic portion 252.The U-shaped elastic portion 252 has a pair of leg portions (notlabeled) extending from the base 251 and bending up and outwards. Ashape of the base 251 is similar to that of the bonding film 23 suchthat the base 251 can substantially adheres to the bonding film 23,thus, improving the bonding strength between the metallic clip 25 andthe metallic housing 21.

A method for making the metallic connecting structure 20 of theelectronic device includes the following steps. A hot press machine (notshown) having a press head is provided. The bonding film 23 is placed onthe inner surface of the metallic housing 21. The hot press machine isturned on and the press head is heated to a first predeterminedtemperature of about 40° C. to about 50° C. After heated to the firstpredetermined temperature, the press head is driven to press the bondingfilm 23 for about two minutes, thereby attaching the bonding film 23 onthe metallic housing 21. The metallic clip 25 is positioned tightly onthe bonding film 23 of the metallic housing 21. The temperature of thepress head is then raised to a second predetermined temperature of about160° C. to about 170° C. After heated to the second predeterminedtemperature, the press head is driven to press the metallic housing 21to the metallic clip 25 for at least two minutes, thereby attaching themetallic clip 25 on the bonding film 23 of the metallic housing 21.

Referring to FIGS. 3 and 4, a metallic connecting structure 30 of anelectronic device in accordance with a second preferred embodiment ofthe present invention is shown. The metallic connecting structure 30includes a metallic housing 31, a bonding film 33, and a metallic stud35. In the second preferred embodiment, the bonding film 33 is athermoplastic adhesive bonding film. The metallic housing 31 issubstantially a flat sheet. A circular depression 32 is defined in aninner surface of the metallic housing 31. A size and a shape of thecircular depression 32 are configured to correspond to a size and ashape of a base of the metallic stud 35. The bonding film 33 adheres toa bottom surface of the circular depression 32 and the metallic stud 35adheres to the bonding film 33 in the circular depression 32correspondingly. Accordingly, the metallic stud 35 is fixed to an innersurface of the metallic housing 31 via the bonding film 33. It should bepointed out that it is better for the depth of the circular depression32 to be greater than the thickness of the bonding film 33.

A similar method for making the metallic connecting structure 30 of theelectronic device includes the following steps. A hot press machine (notshown) having a press head is provided. The bonding film 33 is placed onthe bottom surface of the circular depression 32. The hot press machineis turn on and the press head is heated to a first predeterminedtemperature of about 40° C. to about 50° C. After heated to the firstpredetermined temperature, the press head is driven to press the bondingfilm 33 to the metallic housing 31 for about two minutes, therebyattaching the bonding film 33 on the metallic housing 31. The metallicstud 35 is positioned according to the bonding film 33 of the metallichousing 31 tightly. The temperature of the press head is then increasedto a second predetermined temperature of about 160° C. to about 170° C.After heated to a second predetermined temperature of about 160° C. toabout 170° C., the press head is driven to press the metallic housing 31to the metallic stud 35 for at least two minutes, thereby attaching themetallic stud 35 on the corresponding bonding film 33 of the metallichousing 31.

It is to be understood that, a circular depression 32 of the metallichousing 31 can have other shapes as long as the shape of the circulardepression 32 confirms to the shape of the base of the stud 35. Itshould be pointed out that, the circular depression 32 can be omitted.That is, the metallic stud 35 can be directly fixed to the inner surfaceof the metallic housing 31 via the bonding film 33 anywhere on themetallic housing 31.

The methods for making the metallic connecting structures 20, 30 of theelectronic devices are simple and can further decrease manufacture costbecause of the use of the hot press machine instead of welding. Inaddition, when compared with the welding method, a working temperatureof the methods for making the metallic connecting structures 20, 30 ofthe electronic device is lower, thus the electronic device made by themethods is less likely to deform and/or change color easily due to highheating.

In addition to the metallic clip 25 and the metallic stud 35, many othermetallic elements can be fixed to the metallic housing via the bondingfilm by hot press method.

Finally, while the present invention has been described with referenceto particular embodiments, the description is illustrative of theinvention and is not to be construed as limiting the invention.Therefore, various modifications can be made to the embodiments by thoseskilled in the art without departing from the true spirit and scope ofthe invention as defined by the appended claims.

1. An electronic device having a metallic connecting structure, theelectronic device comprising: a metallic housing; at least one bondingfilm; and at least one metallic clip comprising a base and a U-shapedelastic portion, the U-shaped elastic portion having a pair of feetportions extending from the base and bending up and outwards, whereinthe at least one metallic clip is fixed to an inner surface of themetallic housing via the bonding film. 2-6. (canceled)
 7. The electronicdevice having metallic connecting structure according to claim 1,wherein the bonding film is a thermoplastic adhesive bonding film.